Module Hermetically Sealed Electronic Packages

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JOPTEC LASER CO., LTD

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Name: Module Hermetically Sealed Electronic Packages
Brand: JOPTEC
Price: 1 USD

Brand Name : JOPTEC

Place of Origin : HEFEI, CHINA

MOQ : 50 PCS

Payment Terms : T/T

Supply Ability : 5000000 PCS/Month

Delivery Time : 30 Days

Packaging Details : Boxes

Application fields : Optical communication module

Lead welding method : tin welding

Nickel layer thickness : >3μm

Gold layer thickness : > 0.45μm

Insulation resistance : ≥1000MΩ (DC500V)

Base : Kovar alloy, iron-nickel alloy, copper

Ring frame : Kovar alloy, steel

Lead : Kovar alloy, iron-nickel alloy, copper core composite

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Main performance parameters

Application fields: Optical communication module, pump laser, DCDC power supply, filter, modulator
Lead welding method: tin welding, gold wire bonding
Nickel layer thickness: >3μm
Gold layer thickness:> 0.45μm
Hermeticity: leak rate ≤1x10^-3Pa.cm³/s (He)
Insulation resistance: ≥1000MΩ (DC500V)
material:
Base: Kovar alloy, iron-nickel alloy, copper
Ring frame: Kovar alloy, steel
Lead: Kovar alloy, iron-nickel alloy, copper core composite
Cover plate: Kovar alloy, iron-nickel alloy, steel
Insulator: DM308 or similar, iron sealed glass beads, ceramic
Sealing process and technology: parallel seam welding, laser welding, tin sealing welding, stored energy welding

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Single Function Module HERMETIC Packages

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